New method to improve durability of nano-electronic components, further semiconductor manufacturing

Researchers have developed a novel approach to mitigating electromigration in nanoscale electronic interconnects that are ubiquitous in state-of-the-art integrated circuits. This was achieved by coating copper metal interconnects with hexagonal boron nitride (hBN), an atomically-thin insulating two-dimensional (2D) material that shares a similar structure as the 'wonder material' graphene.

source https://www.sciencedaily.com/releases/2021/06/210601165036.htm